Important Dates

January 05, 2019

Workshop Proposal Due

April 14, 2019

Paper Submission Deadline

May 13, 2019

Author Notification

June 02, 2019

Final Manuscript Due

July 14 - July 17, 2019

Conference Date


Recent Advances on Blockchain and Its Applications

Blockchain has become popular with its tremendous potential in various application fields. In addition to Bitcoin and financial industry, it can be also applied into medical industry, power grids, Internet of Things, shared economy, data management, security, etc. Although the blockchain technology is very promising, it is still in its infancy and many research issues remain unsolved regarding blockchain itself and its applications. For instance, blockchains are able to help creating distributed and decentralized business processes, but its benefits would be seen only after overcoming many challenges, such as efficiency, scalability and privacy. However, the distributed nature of blockchains makes them surprisingly hard to work with in most of application fields. The future of blockchain is still very vague with many advocators and also some negative comments. But the blockchain is definitely worth of the efforts of researchers and practitioners from both industry and academia in order to figure out the perspective of its future.

This symposium will be held in conjunction with IEEE Blockchain 2019 in July 14 - July 17, 2019 in Atlanta, USA. The goal of this symposium is to stimulate discussions on recent advances of Blockchain technologies and its applications. We seek submissions of papers that invent novel techniques, investigate new applications, and discuss approaches to unsolved issues in the field of blockchain.

Topics of interests include, but are not limited to:
– Theories of blockchain and its evolution
– Smart contract and distributed ledger
– Blockchain and Bitcoin security
– Distributed consensus and fault tolerance mechanisms
– Blockchain schemes for decentralization
– Security, privacy and trust of blockchain and decentralized schemes
– Applications with blockchain techniques
– Blockchain applications in IoT
– Blockchain applications in healthcare
– Blockchain applications in business

Submission Instructions
Submitted papers must not substantially overlap with papers that have been published or that are simultaneously submitted to a journal or a conference with proceedings. Papers must be clearly presented in English, must not exceed 6 pages in IEEE Computer Society proceedings format (or up to 8 pages with the 2 pages over length charge), including tables, figures, references and appendices. Papers will be selected based on their originality, significance, relevance, and clarity of presentation assessed by at least three reviewers. Submission of a paper should be regarded as a commitment that, should the paper be accepted, at least one of the authors will register and attend the conference to present the work. All accepted papers will be published in the same IEEE CPS proceedings as IEEE Blockchain (EI Indexed) and collected by IEEE Xplorer Digital Library.

Note: Some submissions to the main conference will be converted to this symposium. All accepted symposium papers could be recommended to submit to the following special issue with 30% - 50% further extension.

Special Issue:

Program Chairs
Zhipeng Cai, Georgia State University, USA
Zheng Yan, Xidian University, China and Aalto University, Finland

Publicity Co-Chairs
Yan Huang, Kennesaw State University, USA
Qin Hu, Indiana University - Purdue University Indianapolis
Yi Liang, Georgia State University

Technical Program Committee
Kai Xu, Arizona State University USA
Zaobo He, Miami University USA
Yan Huang, Kennesaw State University, USA
Zhuojun Duan, University of Hartford, USA
Shengling Wang, Beijing Normal University, USA
Saide Zhu, Georgia State University, USA
Xiuzhen Cheng, The George Washington University, USA
Dongxiao Yu, Shandong University, China
Jiguo Yu, Qilu University of Technology, China
Chaokun Wang, Tsinghua University, China
Yinhao Xiao, The George Washington University, USA
Chunchi Liu, Shandong University, China
Yingjie Wang, Yantai University, China
Ran Bi, Dalian Institute of Technology, China
Yawei Wang, The George Washington University, USA
Jinbao Wang, Harbin Institute of Technology

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